Responsibilities:

• Lead customer-facing technical development programs from kickoff through successful execution.

• Serve as the primary interface between customers and internal engineering teams, communicating technical concepts clearly and managing expectations.

• Drive cross-functional program execution by coordinating engineering, product, manufacturing, and business teams to achieve technical, business, and schedule objectives.

• Lead technical reviews, customer meetings, and executive program updates while proactively identifying risks and driving timely resolution of issues.

• Support New Product Introduction (NPI) activities, including project planning, design reviews, customer deliverables, and schedule management.
• Represent Diamond Foundry's single-crystal diamond technology and advanced packaging capabilities to customers and strategic partners.

Qualifications

• Advanced degree in Materials Science, Materials Engineering, Chemical Engineering, or a related engineering discipline; MBA is a plus.

• 5+ years of experience in semiconductor manufacturing, wafer fabrication, advanced packaging, or related technologies.

• Strong understanding of semiconductor materials, wafer fabrication, device packaging, and bonding technologies.

• Proven customer-facing experience with the ability to communicate complex technical concepts clearly and professionally.

• Exceptional communication, organizational, and program management skills with a demonstrated ability to drive results and meet aggressive deadlines.
• Experience working with semiconductor packaging suppliers and the broader semiconductor ecosystem is highly desirable.

170000 - 230000 USD a year